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110mm Wavy Segmented Diamond Dry-Cut Blade for Stone & Tile

  • Wavy segment design for smooth cutting.
  • Optimized for dry cutting.
  • Low vibration for precise control.
  • OEM / Custom logo available.
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Description

The 110mm Wavy Segmented Diamond Dry-Cut Blade is a specialized cutting tool engineered for fast, clean, and efficient dry cutting of stone, tile, and masonry materials. Featuring an innovative wavy segment design, this blade places diamond segments in a continuous, undulating wave pattern around the steel core. This unique configuration increases the cutting edge contact area, enhances cooling airflow, and reduces vibration, delivering exceptionally smooth, chip-free cuts without the need for water cooling. With its compact 110mm (4-1/3 inch) diameter, it is perfectly suited for handheld angle grinders, offering excellent maneuverability and precision for on-site installations, renovations, and detailed tile work. Whether cutting through porcelain tiles, ceramic tiles, natural stone, or concrete blocks, this blade provides professional-grade dry-cutting performance with minimal dust and debris.

Key Features

  1. Innovative Wavy Segment Design for Smooth, Chip-Free Cuts

    • The continuous wave-shaped segment pattern increases the cutting edge contact area, providing a smoother cutting action that minimizes chipping and breakage on delicate materials like ceramic and porcelain tiles.

    • Delivers exceptionally clean, finished-looking edges often requiring no additional finishing work.

  2. Optimized for Fast, Efficient Dry Cutting

    • Specifically engineered for high-speed dry cutting applications, eliminating the need for water cooling systems and enabling immediate use on any job site.

    • The wavy pattern creates turbulent airflow that effectively cools the blade during operation, preventing overheating even during extended use.

  3. Enhanced Cooling & Debris Removal

    • The undulating segment profile promotes superior airflow and heat dissipation, keeping the blade cool and maintaining segment integrity throughout the cut.

    • Wider gaps between wave peaks facilitate efficient dust and debris ejection, preventing clogging and ensuring consistent cutting performance.

  4. Reduced Vibration for Greater Control

    • The wavy geometry helps dampen harmonic vibrations during rotation, resulting in smoother operation with less chatter and bounce.

    • Reduces operator fatigue and provides greater control, especially during detailed or precision cutting tasks on handheld grinders.

  5. Versatile Material Compatibility & Easy Installation

    • Highly effective on a wide range of materials including porcelain tiles, ceramic tiles, natural stone, marble, granite and brick.

 

TECHNICAL SPECIFICATIONS

Specification Details
Blade Diameter 110mm
Bore Size 20mm
Segment Height 12mm
Bonding Type Hot-pressed / Laser-welded
Cutting Type Dry
Material Diamond + Alloy Steel Core
Application Porcelain tiles, Ceramic tiles, Natural stone, Marble, Granite, Brick
Color Varnish (custom colors available)
Usage Industrial Cutting / Construction / Stone Work
Custom Logo Yes (OEM accepted)

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